![more](/img/icon/ic_prev.png)
![menu](/img/icon/ic_hamburger.png)
Номер части | MFG | Техническая спецификация | Описание | Q'ty | Датакод | Расположение | Рег Дата | Поставщик | RFQ |
K4B2G0846D
![]() |
SEC |
![]() |
BGA | 10000 | 2022+ | INSTOCK | 24-08-28 | Nego IC Co. |
Цитата
![]() |
K4B2G0846D-BCH9
![]() |
SA |
![]() |
BGA | 16666 | 2022+ | INSTOCK | 24-08-28 | Nego IC Co. |
Цитата
![]() |
K4B2G0846D-BCK0
![]() |
SEC |
![]() |
BGA | 19999 | 2022+ | INSTOCK | 24-08-28 | Nego IC Co. |
Цитата
![]() |
K4B2G0846D-BYK0
![]() |
SAMSUNG |
![]() |
BGA | 19999 | 2022+ | INSTOCK | 24-08-28 | Nego IC Co. |
Цитата
![]() |
K4B2G0846D-HC
![]() |
- |
![]() |
BGA | 19999 | 2022+ | INSTOCK | 24-08-28 | Nego IC Co. |
Цитата
![]() |
K4B2G0846D-HCF8
![]() |
SAMSUNG |
![]() |
FBGA | 10000 | 2022+ | INSTOCK | 24-08-28 | Nego IC Co. |
Цитата
![]() |
K4B2G0846D-HCF8000
![]() |
SAMSUNG |
![]() |
BGA | 19999 | 2022+ | INSTOCK | 24-08-28 | Nego IC Co. |
Цитата
![]() |
K4B2G0846D-HCH9
![]() |
SAMSUNG/ |
![]() |
BGA | 104 | 2020+ | Instock | 24-08-28 | IC Agent Electronics Ins |
Цитата
![]() |
K4B2G0846D-HCH9
![]() |
SAMSUNG |
![]() |
BGA | 10000 | 2022+ | INSTOCK | 24-08-28 | Nego IC Co. |
Цитата
![]() |
K4B2G0846D-HCH9. | IC |
![]() |
8 | 2020+ | Instock | 24-08-28 | IC Agent Electronics Ins |
Цитата
![]() |
|
K4B2G0846D-HCH9.
![]() |
FUJITSU |
![]() |
SOP-8 | 19999 | 2022+ | INSTOCK | 24-08-28 | Nego IC Co. |
Цитата
![]() |
K4B2G0846D-HCH900
![]() |
CONSONANCE |
![]() |
19999 | 2022+ | INSTOCK | 24-08-28 | Nego IC Co. |
Цитата
![]() |
|
K4B2G0846D-HCK
![]() |
SAMSUNG |
![]() |
BGA | 19999 | 2022+ | INSTOCK | 24-08-28 | Nego IC Co. |
Цитата
![]() |
K4B2G0846D-HCK0
![]() |
SAMSUNG/ |
![]() |
BGA | 992 | 2020+ | Instock | 24-08-28 | IC Agent Electronics Ins |
Цитата
![]() |
K4B2G0846D-HCK0
![]() |
SAMSUNG |
![]() |
FBGA | 22400 | 20+PB | Pb-Free | 24-08-28 | FEDERAL INDUSTRY CO. |
Цитата
![]() |
K4B2G0846D-HCK0
![]() |
SAMSUNG |
![]() |
FBGA | 10000 | 2022+ | INSTOCK | 24-08-28 | Nego IC Co. |
Цитата
![]() |
K4B2G0846D-HCK000
![]() |
SAMSUNG |
![]() |
10000 | 2022+ | INSTOCK | 24-08-28 | Nego IC Co. |
Цитата
![]() |
|
K4B2G0846D-HCKO | SAMSUNG |
![]() |
BGA | 1260 | 20+PB | Pb-Free | 24-08-28 | FEDERAL INDUSTRY CO. |
Цитата
![]() |
K4B2G0846D-HCKO
![]() |
SAMSUNG |
![]() |
FBGA | 10000 | 2022+ | INSTOCK | 24-08-28 | Nego IC Co. |
Цитата
![]() |
K4B2G0846D-HCMA | SAMSUNG/ |
![]() |
BGA | 400 | 2020+ | Instock | 24-08-28 | IC Agent Electronics Ins |
Цитата
![]() |
K4B2G0846D-HCMA | SAMSUNG |
![]() |
BGA | 68362 | 20+PB | Pb-Free | 24-08-28 | FEDERAL INDUSTRY CO. |
Цитата
![]() |
K4B2G0846D-HCMA
![]() |
SAMSUNG |
![]() |
BAG | 10000 | 2022+ | INSTOCK | 24-08-28 | Nego IC Co. |
Цитата
![]() |
K4B2G0846D-HCNB
![]() |
SAMSUNG |
![]() |
BGA | 19999 | 2022+ | INSTOCK | 24-08-28 | Nego IC Co. |
Цитата
![]() |
K4B2G0846D-HYF8
![]() |
SAMSUNG |
![]() |
BGA | 19999 | 2022+ | INSTOCK | 24-08-28 | Nego IC Co. |
Цитата
![]() |
K4B2G0846D-HYH9 | SAMSUNG/ |
![]() |
BGA78 | 9387 | 2020+ | Instock | 24-08-28 | IC Agent Electronics Ins |
Цитата
![]() |
K4B2G0846D-HYH9 | SAMSUNG |
![]() |
BGA | 168 | 20+PB | Pb-Free | 24-08-28 | FEDERAL INDUSTRY CO. |
Цитата
![]() |
K4B2G0846D-HYH9
![]() |
SAMSUNG |
![]() |
FBGA | 10000 | 2022+ | INSTOCK | 24-08-28 | Nego IC Co. |
Цитата
![]() |
K4B2G0846D-HYK0
![]() |
SAMSUNG |
![]() |
BGA | 10000 | 2022+ | INSTOCK | 24-08-28 | Nego IC Co. |
Цитата
![]() |
K4B2G0846D-HYKO
![]() |
SAMSUNG |
![]() |
BGA | 19999 | 2022+ | INSTOCK | 24-08-28 | Nego IC Co. |
Цитата
![]() |
K4B2G0846D-MCF8
![]() |
SAMSUNG |
![]() |
BGA | 19999 | 2022+ | INSTOCK | 24-08-28 | Nego IC Co. |
Цитата
![]() |